>>12104110 they are 3D structures but the wafers are not really "on top of each other", that anon is talking about making a full superstructure with waffers on "top of each other" obviously interconected this way acting as a single unit this will allow maximum space efficienfy (same reason for building skycrappers, you get a huge efficiency/use out of every square foot of your ground) but the problem in doing chips this way is heat
right now we are in a intermediary phase where with "multicores" where the waffers are not "on top of each other" but side by side and in their own encapsule to dissipate heat
i agree with that anon that well designed software can improve dramatically the general performance of an existing chip without the need for new faster ones but obviously this is not a good idea for the chip industry, unironically a lot of software companies make bloated programs "almost" on purpose so the whole industry can move
"almost on purpose" meaning making a streamlined program is not a top priority
i'm typing this on a 10 year old notebook and I don't have the need for a new one, but if I was into the latest games I would be basically obligated to be constantly upgrading, interestingly enough the whole industry moves on gaming alone
